labarai

1. Buƙatar Muhimmi daga Sabis na AI da Cibiyoyin Bayanai

Sabar AI suna wakiltar mafi girman tushen buƙata mai ƙaruwazane mai ƙarancin dielectric na gilashin fiberTsarin horo da fahimtar AI ya dogara ne akan musayar bayanai mai yawa, wanda ke buƙatar amfani da PCBs masu ƙididdigewa da fasahar haɗin gwiwa mai sauri; wannan yana sanya buƙatu masu yawa akan halayen dielectric da kwanciyar hankali na kayan aiki. Tare da karɓar fasahohi kamar PCIe 6.0 da 224G na gani, buƙatun aiki don laminates masu lulluɓe da jan ƙarfe (CCL) a cikin sabar AI sun canza daga daidaitattun ƙarancin asara zuwa ƙimar ƙarancin asara (ULL) da ƙarancin asara (HLL), wanda ke haifar da ƙaruwar buƙatun maki masu dacewa na zane mai ƙarancin asara na gilashin dielectric. Bayanan kasuwa sun nuna cewa ƙimar CCLs a cikin sabar AI ya ninka sau 5 zuwa 8 na sabar gargajiya. A matsayin babban kayan aiki, zane mai ƙarancin asara na gilashin dielectric ya ga farashinsa ya kai 320,000–350,000 RMB/ton a 2025 - ƙaruwa da kashi 20% tun farkon shekara - tare da wasu takamaiman samfuran suna fuskantar hauhawar farashi har zuwa 250%–300%.

Dangane da gibin da ake da shi tsakanin samar da kayayyaki da bukatar kayayyaki, wanda hakan ke haifar da karuwar bukatar abokan ciniki na AI da ke kasa da haka da kuma takaita karfin samar da kayan lantarki masu inganci a sama, matakan tsaro na kayan lantarki masu inganci a manyan masana'antun CCL sun ragu zuwa kasa da mako guda, wanda hakan ke nuna raguwar bukatar kayayyakin da ake da su a tarihi. Don biyan bukatar kayayyakin da ake da su a manyan kayayyaki, masana'antun CCL sun tilasta musu kara farashin sayayya. Ganin yadda farashin yake a yanzu da kuma yanayin bukatar kayayyaki, kayan gilashin fiber masu inganci na iya ganin karuwar girma da farashi a lokaci guda.

2. Bukatun Aiki don Marufi Mai Girma na Chip

Fasahar marufi mai zurfi don kwakwalwan AI tana wakiltar wani muhimmin yanayin aikace-aikacen donzane mai ƙarancin dielectric na gilashin fiberYayin da hanyoyin kera guntu ke ci gaba zuwa ga ma'aunin 3nm da kuma sama da haka, yawan marufi yana ci gaba da ƙaruwa. Abubuwan ABF - masu ɗaukar kaya masu mahimmanci waɗanda ke haɗa guntu zuwa PCBs - suna sanya buƙatu masu tsauri sosai akan halayen dielectric da tsarkin kayan tushe. Yawanci, ma'aunin dielectric dole ne ya faɗi cikin kewayon 3.0–4.0 (a 1 MHz), ya danganta da mitar aiki, yayin da dole ne a sarrafa ma'aunin dissipation (Df) tsakanin 0.005 da 0.010 (a 1 MHz); aikace-aikacen mita masu yawa (kamar 5G da sadarwa mai sauri) na iya buƙatar ma ƙananan ƙima (<0.005). Bugu da ƙari, don biyan buƙatun marufi mai yawa, kayan dole ne su daidaita ƙarancin Coefficient of Thermal Faɗaɗawa (CTE) tare da juriyar zafi mai yawa don hana karyewar da'ira da damuwa mai zafi ke haifarwa. Yadin zare na Quartz (wanda kuma aka sani da "Q-masana'anta" ko "yadin lantarki na ƙarni na uku") ya fito a matsayin kayan da aka fi so ga abubuwan ABF saboda ƙarancin dielectric constant (2.2-2.3), ƙarancin dielectric asara (Df na 0.001-0.0005), da kuma ikon jure yanayin zafi na dogon lokaci na 600°C ko sama da haka.

Saurin karuwar jigilar kayayyaki ta hanyar amfani da na'urorin AI a duniya yana haifar da faɗaɗa buƙatar masana'anta ta quartz kai tsaye. A cewar hasashen Future Think Tank, ana sa ran kasuwar masana'anta ta quartz ta duniya za ta kai dala biliyan 3.127 nan da shekarar 2031, tare da karuwar ci gaba a kowace shekara (CAGR) na 23.30%. Wannan hasashen yana nuna hauhawar buƙatu, wanda ya dogara ne akan ci gaba da hauhawar jigilar kayayyaki ta hanyar amfani da fasahar marufi ta zamani. Bugu da ƙari, haɓaka dandamali na AI na ƙarni na gaba - kamar "Rubin" - ya dace da tsarin kera guntu na 3nm ko N4 kuma yana amfani da marufi na babban substrate na CoWoS-L. Waɗannan dandamali sun haɗa tarin HBM4 guda takwas don biyan buƙatun babban bandwidth da haɗin kai, suna ba da mafita mafi kyau don haɓaka ƙarfin kwamfuta. Bukatun manyan substrates da aiki mai tsauri za su ƙara faɗaɗa buƙatar kayan kayan masana'anta na quartz, suna haifar da juyin halittar masana'anta na gilashin Low-Dk (ƙananan dielectric constant) zuwa ƙananan constant dielectric da ƙananan halayen asara.

3. Tasirin Ci Gaban Haɗin Gwiwa A Faɗin Sassan Da Dama

Bayan babban ɓangaren ƙarfin kwamfuta na AI, buƙata daga fannoni kamar sadarwa ta 5G/6G da na'urorin lantarki na masu amfani da kayayyaki masu inganci suna haifar da haɓaka haɗin gwiwa tare da AI. Juyin halittar daga fasahar 5G millimeter-wave (24-100 GHz) zuwa fasahar terahertz ta 6G (kimanin mita 100 GHz-3 THz) ya ƙunshi mitoci masu yawa waɗanda ke sa kayan aikin sadarwa su kasance masu matuƙar saurin kamuwa da asarar sigina. Yayin da zamanin 5G ya buƙaci masana'anta mai ƙarancin asara ta fiberglass, zamanin 6G ya sanya ƙarin buƙatu masu tsauri don ma'aunin dielectric (Dk) da dissipation factor (Df): Dk dole ne ya faɗi zuwa 2.0–3.0 (a >100 GHz), kuma Df dole ne ya ragu daga ma'aunin 5G na 0.003–0.005 (a 10 GHz) zuwa 0.0001–0.0007 (a 100 GHz), yana haifar da buƙatar masana'anta mai "ƙarancin asara". A ɓangaren kayan lantarki na masu amfani da na'urorin lantarki, iPhone 17 ta ɗauki ƙananan CTE (haɗin faɗaɗa zafi) da ƙananan masana'anta masu ƙarancin dielectric da Honghe Technology ke samarwa don magance ƙalubale kamar haɗa guntu na A10 Pro 3nm, hana wargajewa a cikin manyan uwaye masu yawa, da rage asarar kuzari a cikin siginar 5G/Wi-Fi 7 mai yawan mita. Wannan matakin yana nuna saurin sauyawar masana'antun lantarki masu yawan gaske daga aikace-aikacen masana'antu zuwa manyan kayan lantarki na masu amfani, yana haifar da ƙaruwar buƙatun kayan aiki da tsawaita lokacin isarwa. Haɓaka kayan lantarki na motoci yana kuma ba da gudummawa ga ƙaruwar buƙata; tuƙi mai saurin kai (Mataki na 3 da sama) yana buƙatar na'urori masu auna ADAS da yawa da radar masu yawan mita. Waɗannan tsarin suna buƙatar kwanciyar hankali na watsa sigina, amincin haɗin gwiwa na solder na dogon lokaci, da juriya ga matakin mota akan girgiza, zafi, da danshi. Saboda haka, kayan allon da'ira waɗanda ke nuna ƙarancin dielectric constants, ƙarancin dielectric asara, juriyar CAF (conductive anodic filament), da ƙarancin CTE sun zama zaɓin da aka fi so ga tsarin tuƙi mai hankali, wanda ke ƙara hanzarta ɗaukar masana'anta mai girman fiberglass. Hasashen masana'antu sun nuna cewa kasuwar masana'antar lantarki mai ƙarancin dielectric-continent a duniya za ta iya kaiwa yuan biliyan 3.76 nan da shekarar 2031, wanda ke ƙaruwa da kashi 10.1% a kowace shekara - wani yanayi da galibi ke haifar da haɗuwar buƙata a sassa daban-daban.

Babban abin da ke haifar da faɗaɗa ƙarfin kwamfuta shi ne keɓance iyakokin kayan aiki. Daga PCBs masu ƙarancin asara da ake amfani da su a cikin sabar AI da masana'anta na quartz a cikin marufi na zamani zuwa laminates masu inganci don kayan lantarki na masu amfani da wutar lantarki da tuƙi mai cin gashin kansa, masana'anta mai ƙarancin dielectric fiberglass tana shiga cikin wani "lokacin da ba a taɓa gani ba a cikin haske." A tsakiyar yanayin buƙatar wadata wanda ke da alaƙa da hauhawar girma, hauhawar farashi, da ƙarancin iya aiki, wannan "masana'antar lantarki" mai sauƙi da alama ta fito babu shakka a matsayin ɗaya daga cikin sassan ci gaba mafi fashewa waɗanda ke haɗa kayayyakin more rayuwa na kayan aikin AI da fasahar sadarwa mai saurin zamani na zamani.